Alpha and Omega Semiconductor Introduces Half-Bridge MOSFET for Power Supplies Applications
Alpha and Omega Semiconductor Unveils Space-Saving XSPairFET for Compact DC-DC Applications
BonChip Electronics, a trusted distributor of Alpha and Omega Semiconductor (AOS) products, is excited to announce the availability of the innovative AONG36322 XSPairFET. This groundbreaking device from AOS addresses the critical challenge of limited space in DC-DC applications, offering exceptional performance and significant size reduction.
Optimizing Design for Space-Constrained Applications
The AONG36322 is specifically designed for DC-DC applications where board space is a premium. Its innovative features deliver substantial benefits:
- Compact DFN3.5x5 Package: The AONG36322 utilizes a revolutionary asymmetric DFN3.5x5 XSPairFET package. This innovative design allows it to replace a traditional DFN5x6 asymmetric half-bridge MOSFET, achieving an impressive size reduction of approximately 60%.
- Reduced PCB Footprint: The smaller package size of the AONG36322 translates to a significantly reduced footprint on the PCB. This allows for more streamlined DC-DC architecture and more efficient overall design.
These space-saving advantages make the AONG36322 ideal for a new generation of compact DC-DC buck converters in various applications, including:
- Point-of-Load (POL) Computing
- USB Hubs
- Power Banks
Advanced Features for Enhanced Performance
The AONG36322 builds upon the strengths of the existing AOS XSPairFET lineup and incorporates cutting-edge technologies:
- Latest Bottom-Source Packaging: The AONG36322 leverages the latest bottom-source packaging technology, ensuring optimal performance.
- Integrated High-Side and Low-Side MOSFETs: The device integrates two 30V MOSFETs in a half-bridge configuration, with low on-resistance values:
- High-Side MOSFET: 4.5 milliohms maximum on-resistance
- Low-Side MOSFET: 1.3 milliohms maximum on-resistance
- Enhanced Thermal Dissipation: The low-side MOSFET source is directly connected to the exposed pad on the PCB, facilitating superior thermal dissipation.
- Reduced Parasitic Inductance: The advanced packaging design of the AONG36322 minimizes parasitic inductance, significantly reducing switch node ringing and improving overall efficiency.
Addressing Critical Design Challenges
“With the AONG36322 XSPairFET, we aimed to address the ongoing challenge of limited board space faced by our customers," said Peter H. Wilson, Marketing Sr. Director of MOSFET product line at AOS. "This innovative device, combined with our groundbreaking AOS XSPairFET design, empowers designers to achieve improved power density and efficiency. This is a significant step forward in meeting the ever-increasing performance demands of POL Buck applications."
BonChip Electronics: Your Partner for AOS Power Solutions
As a leading distributor of AOS products, BonChip Electronics offers the complete line of AOS XSPairFET devices, including the new AONG36322. Our team of experts can assist you in selecting the optimal solution for your specific DC-DC application needs. We offer:
- Comprehensive product knowledge: Our team possesses in-depth knowledge of AOS products and can guide you through the selection process, ensuring compatibility and optimal performance.
- Streamlined ordering process: We offer a user-friendly online platform for easy ordering and fast delivery.
- Technical support: Our team is readily available to answer any technical questions you may have regarding AOS products.
Contact BonChip Electronics today to explore how the AONG36322 XSPairFET can empower you to create smaller, more efficient DC-DC converters for your next space-constrained application.
