Infineon Enhances Thermal Efficiency of Power MOSFETs for Use in Automotive ECUs
Infineon Revolutionizes Automotive Power Design with SSO10T TSC Package and OptiMOS MOSFET Technology
Infineon Technologies, a leading innovator in power systems and IoT solutions, unveils the groundbreaking SSO10T TSC package featuring OptiMOS™ MOSFET technology. This innovative package boasts a revolutionary direct top-side cooling concept, delivering exceptional thermal performance in automotive applications.
Unparalleled Thermal Management for Enhanced Efficiency
The SSO10T TSC eliminates heat transfer into or through the printed circuit board (PCB) of the automotive electronic control unit (ECU). This eliminates the need for complex heat dissipation strategies, simplifying the design process. Additionally, the package facilitates a compact double-sided PCB layout, minimizing cooling requirements and system costs for next-generation automotive power designs.
Ideal Applications for Diverse Automotive Needs
The SSO10T TSC's superior thermal management makes it perfectly suited for a wide range of automotive applications, including:
- Electric Power Steering (EPS)
- Engine Management Systems (EMS)
- Power Distribution Modules
- Brushless DC Drives (BLDC)
- Safety Switches
- Reverse Battery Protection
- DC-DC Converters
Compact Footprint, Superior Performance
With a footprint of only 5 x 7 mm², the SSO10T TSC maintains a compact design while exceeding expectations. Building upon the established SSO8 industry standard, the SSO10T TSC offers significant performance improvements. Thanks to its top-side cooling, it delivers 20% to 50% higher performance compared to the SSO8, depending on the thermal interface material (TIM) used and its thickness.
Broad Compatibility and Future-Proof Design
The SSO10T TSC package is JEDEC-listed for the open market, ensuring wide second-source compatibility. This allows for easy and rapid adoption as the future standard for top-side cooling in automotive electronics.
Key Features and Benefits
- Direct Cooling Path to ECU Housing: Enables exceptional thermal performance.
- Improved Thermal Resistance (Zth and Rth): Delivers up to 50% better heat dissipation compared to the SSO8.
- Double-Sided PCB Design: Simplifies layout and reduces board size.
- Higher Application Currents: Supports demanding power requirements.
- JEDEC Listed and Second-Source Compatible: Ensures design flexibility and future-proof adoption.
Additional Advantages
- Minimized System Area: Compact design reduces overall system size.
- Reduced Cooling Efforts & Costs: Eliminates the need for vias in the PCB, simplifying heat dissipation strategies.
- Lower System Costs & Design Efforts: Streamlined cooling requirements minimize design complexity.
- High Power Density & Efficiency: Supports the development of high-performance and sustainable vehicles.
BonChip Electronics - Your Trusted Distributor for Infineon SSO10T TSC Packages
BonChip Electronics is your authorized distributor for Infineon Technologies. We offer the complete line of innovative Infineon products, including the revolutionary SSO10T TSC package. Our commitment to exceptional service and fast delivery ensures a smooth and efficient purchasing experience.
Contact BonChip Electronics today to discuss your SSO10T TSC requirements and explore how this innovative package can empower your next automotive power design!
