Siemens Develops a Safe Method for Distributing Integrated Circuit Thermal Models Across the Electronic Supply Chain
Integrated circuit designers now have a means to confidentially distribute thermal models through the supply chain without exposing sensitive chip design information.
Siemens has recently introduced enhancements to its electronic cooling simulation tool, aimed at bolstering the security and exchangeability of IC thermal models.
Confronting the threat of excessive heat in compact, high-density chips, it's pivotal for IC designers to conduct comprehensive thermal analysis and management. Although in-depth thermal models are essential for preventing thermal damage, they typically unveil the detailed physical layout of the IC. Consequently, to safeguard their trade secrets, semiconductor manufacturers are cautious about sharing these thermal details throughout the electronic supply chain.
IC designers can now share accurate reduced-order thermal models of IC packages for 3D CFD thermal analysis.
Siemens claims that its new Embeddable Boundary Condition Independent Reduced Order Model (BCI-ROM) technology, now available in the company's updated Simcenter Flotherm software, enables semiconductor companies to create accurate, sharable 3D thermal analysis models that don't expose sensitive IP.
Siemens Introduces Embeddable BCI-ROM Technology
Siemens’ Flotherm, a part of the company’s Xcelerator portfolio, is a comprehensive thermal management software for integrated circuit design. By simulating airflow and heat transfer in and around electronic equipment, Flotherm can generate detailed thermal models of electronic systems, enabling engineers to predict thermal performance, optimize design, and prevent overheating.
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Embeddable BCI-ROM (EROM) versus conventional thermal models.
BCI-ROM technology creates reduced-order thermal models of IC packages for 3D CFD electronics cooling simulations. Siemens asserts that it also effectively compresses complex thermal models into a simpler form. Independent of specific boundary conditions, the technology enables designers to embed the models in different thermal environments, yielding accurate temperature predictions across various systems.
BCI-ROM Boosts Accuracy, Security, and Transparency
Flotherm's BCI-ROM technology is considered a substantial advancement over traditional modeling methods like the 2-Resistor and DELPHI models. Because BCI-ROM can accurately simulate transient thermal behaviors and manage multiple heat sources in intricate IC packages, engineers can quickly and flexibly iterate thermal solutions.
Workflow of embeddable BCI-ROMs vs. thermal netlists.
Engineering teams can now share high-fidelity thermal simulation data across the electronics supply chain without revealing the IC package's internal geometry and material properties.
A Secure Forum on Thermal Management
As chips' power densities continue to increase, IC designers need a secure, collaborative method for sharing thermal management data.
Siemens believes that reduced-order models enable different stakeholders in the electronics supply chain to access vital thermal data for design and testing without the risk of revealing sensitive design details inherent in the full models. This balance of information sharing and IP protection is vital for innovation and efficiency in electronic design and production.
